Dr. Simon Lin 林思宏

0916-700-470

E-mail: [email protected]

Objective

Pursuing an assistant professor position in college that best utilizes my semiconductor and electrochemical knowledge and experiences to implement advanced researches and to instruct college/graduate students.

Personal qualification

·         Familiar with advanced thin films (CVD, PVD, CMP) processes and ultra low-k dielectrics (CVD, SOD) properties and integration

·         Hands-on experiences on major vendor's tools like AMAT, TEL, NVLS and all kinds of metrology tools

·         Solid background of electrochemical and semiconductor fundamental theories.

·         Strong capability in statistical designs for conducting experiments.

·         Extensive knowledge about computer hardware configurations and software applications.

Education

University of Southern California                                                                                                      Los Angeles, CA

Ph.D. in Materials Science and Engineering                                                                                                     August 1995

Thesis Title / Thesis Advisor

Corrosion Protection of High-Copper Aluminum Alloys and Stainless Steels by Surface Modification / F. Mansfeld

University of Southern California                                                                                                      Los Angeles, CA

M.S. in Materials Science and Engineering                                                                                                 December 1990

National Tsing-Hua University                                                                                                        Hsin-Chu, Taiwan

B.S. in Materials Science and Engineering                                                                                                           June 1986

Experiences

Technical Manager/TSMC                                                                                                                June 2002 - present

Dielectrics in 90 Nano technology

Project Engineer/SEMATECH, TSMC Assignee                                                                          July 1999 - Jan 2002

Advanced low-k dielectrics characterization and integration (k<2.5).

Principal Process Engineer/TSMC                                                                                        September 1997 - June 2002

Group leadership in thin film module including CVD, PVD, and CMP technologies.

Process Engineer/Applied Materials                                                                         December 1995 - September 1997

Hand-on experience of poly-silicon and WSix CVD processes and integration in Applied Materials Centura HTF system.

Research Assistant/Sandia National Lab.                                                                            September 1990 - May 1994

Surface modification of high-Cu Al alloys by removing surface Cu intermetallic compounds, which provide cathodic driving force causing pitting corrosion.

Research Assistant/NSF                                                                                                                 1991 - Summer 1992

Surface modification for type 304 SS using alternating voltage (AV) passivation to improve its corrosion resistance to achieve that of higher grade SSs like 316 SS.

Application of statistical factorial designs to AV passivation for determination of the optimum process conditions to achieve the best experimental results.

Research Assistant/Cal-Chem Co.                                                                                      December 1994 - May 1995

Surface cleaning and passivation for type 316L SS using environmentally friendly agents for the replacement of concentrated HNO₃ (ASTM A-380).

Research Assistant                                                                                                              May 1994 - November 1994

Corrosion monitoring of painted, galvanized, and bare steels using electrochemical impedance spectroscopy (EIS) technique.

Research Assistant/Office of Naval Research                                                                                          Summer 1993

Surface modification for Al alloys (6061-T6, 7075-T6, and 2024-T3) using non-chromate substitutes.

Teaching Assistant/University of Southern California                                                                                         

Instruct general chemistry theories and conduct experiments.                                                    September 1994 - May 1995

Teaching Assistant for thermodynamics.                                                                                  September 1990 - May 1991

Journal and Conference Publications

Simon Lin, Jia-Ning Sun, David W. Gidley, Jeffrey T. Wetzel, K.A. Monnig, Simon Jang, Douglas Yu and M.S. Liang, “Positron Annihilation Lifetime Spectroscopy (PALS) Application in Metal Barrier Layer Integrity For Porous Low-k Materials”, MRS (2001).

Simon Lin, Jeffrey T. Wetzel, K.A. Monnig, P. A. Winebarger, Simon Jang, Douglas Yu and M.S. Liang, “Effective Porous Low-k in Single Damascene Integration”, AMC (2001). 

Simon Lin, Changming Jin, Lawrence Lui, Minghsing Tsai, Michael Daniels, Albert Gonzalez, Jeffery T. Wetzel, K.A. Monig, P.A.Winebarger, Simon Jang, Douglas Yu and M.S. Liang,  “Low-k Dielectrics Characterization for Damascene Integration”, IITC (2001)

Simon Lin, Robert Shih, Michael Chen, and Y. C. Lin, "Improved Mean Wafer Between Clean of DCS  Chambers by Over-Clean at Low Temperature”, ET Conference (1997).

F. Mansfeld, S. H. Lin, L. Kwiatkowski, "Optimization of Alternating Voltage Passivation Process for Stainless Steel", Corrosion 50 (1994):  p. 838.

F. Mansfeld, S. H. Lin, L. Kwiatkowski, "The Effect of Process Parameters on Alternating Voltage (AV) Passivation of 304 Stainless Steel", Corrosion Science 34 (1993):  p. 2045.

F. Mansfeld, S. H. Lin, L. Kwiatkowski, "Surface Modification of Stainless Steel by an Alternating Voltage Process", Proc. Symp. Modification of Passive Films and Relation to Resistance to Localized Corrosion, EFC Publ. 12, The Institute of Materials, London, England, 1994:  p. 183.

F. Mansfeld, Y. Wang, S. H. Lin, L. Kwiatkowski, "Surface Modification by Chemical and Electrochemical Processes", Proc. 12th. Int. Corros. Cong. (Houston, Texas:  NACE, 1993):  p. 219.

Patents

"Method for Creating a Corrosion-Resistant Surface on an Aluminum-Copper Alloy", USC File No. 2456.  Patent pending.

"Novel Etch Stop Layer Application for 90 Nanometer Technology and Below", Patent filing for Taiwan, Mainland China and USA.

"Densification for Porous Low-k Dielectric Sidewall for Improved Barrier Integrity" Patent No. 1,716,141

"NOVEL SIC N-FREE ETCH STOP LAYER (ESL)" Patent No. 7,375,040

"RELIABILITY IMPROVEMENT OF SIOC ES WITH 3MS GAS PASSIVATION IN CU DAMASCENE INTERCONNECTS" Patent No.  7,193,325

" Composite ESL for Cu damascene application" Patent No. 7,250,364

"Improved WCVD for technology node down to N65" Patent No.  7,138,337

"Plasma ion bombardment reduction for thin gate oxide (< 15A) using Decoupled Plasma Nitridation (DPN) processes"

"Post-treatment of single metal gate for high-k/metal gate to achieve N-, P-MOS work functions"

"Potentiostat application in SiO2 and HfO2 wet etching selectivity"

"N, P metal crystal orientation for high-k metal/gate small Vt modulation"

"Modified high-k/metal gate processes to suppress Fermi-level pinning for P-Metal"

"Plasma Ion Bombardment Reduction in Gate Dielectrics Doping for 450nm wafers"

"New integration scheme for high-k/metal gate N, PMOS patterning"

References

Professor F. Mansfeld / Chairman / Department of Materials Science / USC (213)-7404428

Dr. Jeff Wetzel / Program Manager / Low-k Dielectrics / International SEMATECH (512)-356-3402

More upon request