Four Main IC Manufacturing Stages
(Harrison 1989; Chen 1987)
The following chart lists 4 main manufacturing stages through which a wafer lot
passes, where each stage is usually performed, and typical cycle time and yields
for each stage.
| STAGE | LOCATION | CYCLE TIME | YIELD |
| 1. Wafer Fabrication | Fabrication Plant | 20-40 days | 92% ( good wafers) |
| 2. Wafer Probe | Fabrication Plant | 3-5 days | 25 -75% para produtos maduros |
| (die bank inventory) | |||
| 3. Chip Assembly | Assembly plant | 3-10 days | 92-98% Plant (units out per unit started) |
| 4. Chip test | Assembly plant | 4-15 days | 10-92% Plant (low for new products) |
| (final goods inventory) | 30-70 days( overall) | 30-70 days( overall) |