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FEA Analysis |
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FEA projects from school (RPI), internship (Pratt & Whitney), and work (Siemens). |
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Schematic a1: stress distribution of camera pattern holder (Siemens Medical Systems |
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Schemactic a2: displacement plot of the camera pattern holder (Siemens Medical Systems) |
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Schematic b1: 3-D modeling of a vendor's weldernose assembly |
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Schematic b3: 3-D stress analysis for the weldernose assembly depicting multiple linear / non-linear contacts |
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Schematic b2: 3-D stress analysis of the nose-press of the weldernose assembly |
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Schematic b4: 3-D stress & displacement analysis on the 10th stage disk of a turbofan aircraft engine during inertia bonding |
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Schematic b5: another view of this analysis showing the simulated effect of the 10th stage disk during inertia bonding |
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Schematic c: class project (RPI) |
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