Experienced, 20+ years, engineering professional specializing in the design, build, and qualification of high-speed progressive dies for automotive and miniature electronic connectors. Hands on experience with all aspects of APQP (Advance Product Quality Planning). Recognized with 3 U.S. Patents, for developing innovative features and techniques for the development and manufacturing of connector systems for the OEM electronics and automotive markets.
Team Leader for 1mm Solid Pin Crimp connector development. Developed the product, acquired tooling, and qualified it to QS9000 standards. Filed patent application for connector design features. Patent should be granted by the end of 2001.
Developed an APQP (Advanced Product Quality Plan) for use in tracking and developing stamping, molding, and assembly tooling. This was used in the development of the QS9000 Quality System.
Implemented a cost effective on-line vision inspection system for stamping that eliminated customer defects through 100% inspection of the product.
Responsible for stamping tooling on new product development teams, working with product engineering, purchasing, customers, and suppliers.
Manufacturing Engineering representative for supplier development team involved with on-site quality audits of potential suppliers.
Developed equipment that assembled a deep drawn sleeve to a stamped terminal in-line with the stamping press resulting in a finished product in a single operation.
Initiated a $150K annual raw material cost savings through revised tolerances that resulted in the material being produced to design intent dimensions.
Developed a packaging system for customer shipment. Shipping damage was eliminated and a 30% cost savings in packaging was realized.
HOLMBERG ELECTRONICS CORP. 1983 - 1989
Senior Design Engineer
Responsible for progressive die design for miniature electronic connectors.
Initiated a product redesign resulting in a 50% reduction in raw material usage.
Designed automatic assembly machine for D-sub miniature connector assembly.