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Chapter 2

EMISSION AND ADSORPTION PROCESSES (TIC ELECTRODES)

TIC operation is strongly dependent on the processes which occur on the electrode surfaces, especially on the cathode. The emission of electrons and ions (surface ionization), and adsorption and evaporation are some of these important processes.

1. Thermionic Emission

Upon heating, all bodies, both solid and liquid, emit electrons. Consider first thermionic emission from metals, and then briefly, thermionic emission from semiconductors.

According to modern concepts, valence electrons in a metal form a gas of quasi-free electrons (i.e., they move freely within the metal). And a specific wave vector k#, velocity v# = ћk#/m*, and energy E = ћk#2/2m* may be assigned to each electron. Compared to free electrons in a vacuum, the electron gas in a metal is characterized by very high densities (» 1023 cm3) and also by anisotropy. Electrons moving in different directions generally have different values of effective mass m* because of the effect of the periodic potential in the crystal lattice.

In a specimen of finite volume V, there is a finite number of distinct quantum states for the electron, characterized by discrete values of the wave vector and the spin, which can assume either of two values. Because of the Pauli exclusion principle, no more than one electron can occupy each state in the metal. The electron gas has least energy if the electrons occupy all the lower energy levels simultaneously. This least-energy state occurs only at absolute zero. With increased temperature, the electrons, in part, move to higher energy levels.

In equilibrium, the number of electrons in a state with energy E i is given by the Fermi-Dirac distribution function:

(1.1)

where m is the chemical potential (or Fermi level), which is common to all particles of the system and equal to the change in the free energy of the system when one particle is removed from it. The position of the Fermi level can also be determined from the condition that the total number of occupied levels is equal to the total number of free (valence) electrons in the metal:

(1.2)

Fig. 2.1 shows how the distribution function varies with temperature. At T = 0, all levels of E i < m are occupied, and all levels of E i > m are vacant. As T increases, the sharp boundary between the

20

occupied and vacant states fades. However, the electron gas in the metal remains degenerate even to the highest temperatures; i.e., most of the electrons are in states for which (E i - m )/ kT < 0 and for which fo is close to 1. We can show from (1.1) that the Fermi level of metals shifts slightly lower as temperature increases.

Fig. 2.1

For electrons with energy (E i - m ) > > kT) we can disregard the one in the denominator of (1.1): then

(1.3)

and the Fermi-Dirac distribution becomes the Maxwell-Boltzmann distribution.

Consider now the concept of work function. In all known metals, the Fermi level m is below the vacuum zero energy level, as is shown in Fig. 2.2. This means that the electrons emerging from the metal into the vacuum must overcome a potential barrier, and only fast electrons having a sufficient velocity component in the direction perpendicular to the surface can escape. The work function f is usually defined as the energy difference from the Fermi level to the vacuum zero energy level. It will subsequently be seen that this definition of f is much more convenient for calculation than the work function as the total value of the potential barrier W for the valence electrons of the metal. The presence of a potential barrier indicates that the attraction of the electrons near the surface to the positive ions of the lattice exceeds the repulsion forces between the electrons.

For small distances from the surface, the magnitude and shape of the potential barrier, which an electron must overcome in order to leave the metal, is dependent on the volume properties of the metal and also on the arrangement of the surface atoms, i.e., on the crystallographic orientation of the surface. For example, the work function of different faces of tungsten varies from 4.3 to 5.2 eV. The work function varies even more widely during the adsorption of foreign atoms and molecules on the surface. This is discussed in more detail later.

Fig. 2.2

At sufficiently large distances from the surface, the interaction between the electron and the metal can be characterized as a so-called mirror image force (Fig. 2.3), i.e., by the interaction of the electron and the excess positive charge in the metal surface caused by the presence

21

of the electron. The effect of this surface charge is equivalent to a positive charge + e located at the mirror image point of the electron,* so that the interaction force is

(1.4)

To find the thermionic emission current from a metal to a vacuum it is necessary to calculate the number of electrons incident to the surface from within the metal having sufficient energy to overcome the potential barrier:

(1.5)

Here ri is the quantum-mechanical electron reflection coefficient for the surface barrier, and summation is distributed through all the electrons for which EI > W.

To calculate js directly, it is necessary to know the electron parameters for a specific metal (the velocity and the density of the states) near the vacuum energy level. These parameters are usually poorly known, not to mention the fact that fast thermal electrons in a metal should interact so strongly with the enormous number of slow electrons that the possibility of using a one-electron approximation becomes doubtful. Therefore, to calculate thermionic emission current, a different method is usually preferred.

Fig. 2.3

Consider a metal-vacuum interface in thermodynamic equilibrium (as in a cavity surrounded by metal). The electrons in the vacuum and in the metal, at equilibrium (i.e., with zero net particle and energy flow), should have the same temperature and the same chemical potential. @ Therefore, rather than calculating the current from the metal to the vacuum by formula (1.5), we can calculate the equivalent current, from the vacuum to the metal:

(1.6)

________________

*The mirror image force is determined by the correlated motion of the electron leaving the metal and of the electrons remaining in the metal. The correlated motion of the electrons apparently plays an important role in calculating the potential barrier at shorter distances.

@The free energy of the entire metal-vacuum system consists of the free energy of the metal and of the electrons in the vacuum. The total free energy reaches a minimum when it is not altered by an electron

22

where the factor 2(m/?h)3 is the number of quantum-mechanical states per unit volume of velocity space (including the two spin orientations).

By extracting the average value of the quantum-mechanical reflection coefficient out of the integral, from (1.6) we obtain the well known Richardson formula for thermionic emission:

(1.7)

Here we have f = - m because the electrons in the vacuum are in equilibrium with the metal. The coefficient A,

?

is a universal constant for all metals.

In formula (1.7), only the value, which must be calculated from the characteristics of the metal band structure and surface properties, is dependent on the specific properties of the emitter. The coefficient of slow electron reflection from the metal surface, determined theoretically, is always small (the order of several percent) because of a smooth variation in the mirror image force. Direct experiments with slow electrons also yield small values for r. However, there are data which indicate that the reflection coefficient increases if there are atoms adsorbed on the surface.*

Richardson’s formula has been well confirmed by experiment [2] but this result is not as unchallengeable as might appear. It must first be emphasized that current is a kinetic effect; therefore, it cannot, in principle, be calculated accurately from equilibrium thermodynamics. Formula (1.6) is valid if the distribution function near the solid boundary is in equilibrium. But this is strictly correct only in the absence of current. The existence of an emission current should lead to some depletion in the distribution function for fast electrons, which is not taken into account in the derivation of (1.6). When deriving Richardson’s formula from the principle of detailed balance, not only the quantum-mechanical reflection coefficient but also the fact that the electron can emerge from a solid after having undergone one or several scattering inside should be taken into account.

Thus, in general, an additional kinetic reflection coefficient @r, which is dependent on the temperature and mechanism of electron scattering in the solid [3], should be introduced into Richardson’s formula:

(1.8)

In the case of a metal, there is every reason to expect that @r is small. This is related to the fact that the fast electrons in the metal should relax very rapidly as a result of the strong interaction

______________

transition from the metal to the vacuum or vice versa, i.e., when the chemical potential of the electrons in the metal and in the vacuum are equal.

*It is possible that this is related to a sharper variation of the shape of the potential barrier in the presence of an adsorbed layer [1].

23

among the large number of quasi-free electrons. Or, from the point of view of emission, this means that the generation of fast electrons near the emitting surface of the metal should occur very rapidly, and that deviation of the distribution function near the surface away from equilibrium should be quite small.

Because of the presence of a forbidden band in semiconductors, only conduction electrons (rather than valence electrons, as in metal) participate in thermionic emission (Fig. 2.4). This is not accounted for in the derivation of Richardson’s formula from the principle of detailed balance. The characteristic features of the band structure of semiconductors can be manifested only in the value of the quantum-mechanical reflection coefficient @r. In semiconductors rkin should be greater than in metals. This is especially true of semiconductors with hole conduction, where the electrons emitted into the vacuum must be supplemented by the generation of electron-hole pairs near the surface. Semiconductor cathodes have not yet been used in TICs because of the large transverse ohmic resistance; however, the use of thin semi-conducting films cannot be excluded.

2. Thermal Effects During Thermionic Emission

If the energy of the Fermi level is disregarded, then each emitted electron carries with it a potential energy equal to the work function and a kinetic energy determined by its velocity. As with thermionic emission, the mean kinetic energy of the electron flow can be calculated using the principle of detailed balance. If the dependence of the reflection coefficient on energy is neglected, then this is calculated to be 2 kTC. Thus, the heat of electron evaporation (i.e., the energy flux carried by the current from the metal into the vacuum) is equal to

Fig. 2.4

(2.1)

The energy supplied in the metal to the surface by current is equal to jsP C. (The coefficient P C, which is related to the Seebeck coefficient a by the relation P C = a TC, is called the Peltier coefficient). Thus, the net heat transported from the cathode surface is

(2.2)

24

The coefficients P C and a are small for a degenerate electron gas. Therefore, the heat of electron evaporation from the metal is supplied to the surface mainly by heat conduction. In the case of a semiconductor cathode, the Peltier heat supplied to the cathode surface may contribute an appreciable part of the heat of electron evaporation.

The heat of electron evaporation in electron vacuum devices is usually a small part of the total heat supplied to the cathode; the main heat loss comes from radiation. However, the reverse should be the case in efficient thermionic converters. For example, at js = 20 amp/cm2, TC = 2000° K, and f C = 3 eV, the heat of electron evaporation is approximately 70 W/cm2 whereas the thermal radiation flux is about 20 W/cm2 for e = 0.3.

In like manner, we can calculate the heat delivered to the anode:

(2.3)

Here j is the current to the anode, f A its work function, EIkin the mean kinetic energy of the electron flow near the anode, and P A the Peltier coefficient for the anode.

3. The Contact Potential Difference

If two bodies with different work functions but the same temperature are connected (Fig. 2.5a), there will be no net current, and the Fermi levels of the two bodies will be equal. As can be seen from Fig. 2.5b (where the motive diagram for the case f A = f B is shown), if there is equilibrium between the two bodies, a contact potential difference occurs:

(3.1)

The field of the contact potential difference partially reflects back the electrons emitted by the body with the smaller work function, thus equalizing the currents exchanged between the two bodies. This field is created by the excess charge densities on the body surfaces (Fig. 2.5b), which develops at the first moment the bodies come into contact with each other.

Fig. 2.5

The field of the contact potential difference is also formed between different regions of a single body if they have different work functions as a result of different crystallographic orientations at the surface. In this case, the field of the contact potential difference is called a patch field. Patch fields in regions with a small work function reflect electrons which have emerged into the vacuum (Fig. 2.6), and the patch fields in regions with a large work function accelerate electrons.

Fig. 2.6

25

4. Thermionic Emission in an Accelerating Field

If a field is established between two electrodes, which accelerates emitted electrons, then a linear potential component u2 = - eEx (Fig. 2.7), where E is the absolute value of the electric field intensity, is added to the potential energy of the mirror image force u1 = -e2/4x. As a result, the electron potential energy has a maximum at some distances xo, where the applied field exactly compensates for the effect of the mirror image force:

?

and the work function decreases by an amount

(4.1)

As a result, the emission current is increased by the accelerating field to:

(4.2)

where js0 is the thermionic emission current in the absence of the field. This increase in current is called the normal Schottky effect, the type of field enhancement observed with monocrystals. The normal Schottky effect becomes appreciable with fields the order of 104 V/cm.

In the case of a polycrystalline surface, an external accelerating field is superimposed on the patch field. The external field reduces the retarding potential barrier at the small work function patches (Fig. 2.8). As a result, the emission from these patches increases, i.e., there is gradual "exposure" of the patches, and the total emission current increases with the accelerating field more rapidly than given by formula (4.2) (Fig. 2.9). The increase of current because of "exposure" of the patches is called the anomalous Schottky effect.

Experimental functions j(E) for patchy surfaces sometime approximate a formula similar to (4.2), which can be obtained by introducing the dimensionless coefficient b > 1 into the exponent:

26

(4.3)

As the electric field increases and all the patches become exposed (Fig. 2.8c), b approaches 1. This occurs when the applied field becomes approximately equal in intensity to the patch field: E = D f /ea (where D f is the work function difference of adjacent patches and a is their linear dimension). Thus, the value of the external field at which transition to the normal Schottky effect occurs (b = 1) is determined by the specific surface properties of the emitter and may vary over a wide range-from tens to 104 V/cm [6,7].

Patchiness may be especially pronounced on polycrystalline cathodes with adsorbed layers, because the different adsorption energies of the different faces cause large increases in the D f of the patches. The greatest patchiness is observed with only a moderate degree of coverage [6,8,9].

Cathode patchiness should generally have an unfavorable effect on TIC operation. The emission current comes mainly from the patches with small work functions; so with uniform emission at the level of these patches, it would be possible to have greater total current.

With very strong electric fields, the potential barrier becomes narrow and permeable to electrons, because of the tunnel effect. This type of emission is referred to as field emission. Calculations show that appreciable field emission should occur at electric field intensities the order of 107 V/cm. However, significant field emission is observed in experiments at much smaller field intensities (usually the order of 106 V/cm) as a result of the presence of protrusions and micropoints on the surface, where the local field intensities may be considerably greater than the average.

At high temperatures, fast electrons may tunnel through the peak of the potential barrier, increasing the emission current even more. This enhanced current, called thermal-field emission, may play an important role in arc discharges with a cathode spot. However, there is no appreciable field emission from the cathode in TIC operating modes, because the field at the cathode is considerably less than 106 V/cm.

Fig. 2.7

Fig. 2.8

27

Fig. 2.9

5. Evaporation

There is a specific vapor pressure associated with every solid (and liquid) in a state of thermodynamic equilibrium with its environment. This saturated vapor pressure, for a given temperature, is determined exclusively by the thermodynamic properties of the material in its solid and gaseous phases. These in turn can be calculated or measured by known methods [10]. The equilibrium thermodynamic pressure PT can be calculated using the formula

(5.1)

where D HTo and D STo are the changes in enthalpy and entropy for the evaporation of 1 mole of material at a given temperature T, PO the standard pressure, and R the gas constant. The pressure PT would occur in a cavity with isothermal walls of the particular material. The flow of atoms from the surface (ieva)T under conditions of thermodynamic equilibrium is easily expressed as a function of PT, because the flows of atoms (molecules) to and from the surface should, in this case, be equal to

(5.2)

In practice, the greatest interest is in evaporation into a vacuum, where there is no back flow of atoms (or molecules) to the solid surface. To calculate the rate of vacuum evaporation, through analogy with radiation and thermionic emission, we can introduce some coefficient into expression (5.2) which would take into account the fact that part of the atoms in thermodynamic equilibrium are reflected from the surface. If the fraction of the reflected atoms is equal to r, the rate of vacuum evaporation is equal to

(5.3)

The quantity a = (1 — r) is the accommodation coefficient. It is defined similar to the absorption coefficient of thermal radiation theory.

When calculating thermodynamically the equilibrium pressure by the rate of evaporation, data are usually obtained with the so-called Knudsen effusion chamber [11,12], which, by analogy with the well known black-body model, is a cavity whose walls (with the exception of a small aperture) are covered with the investigated material. In this particular case, the coefficient of reflection of atoms from the surface may be assumed equal to zero, because the probability of the emergence of an atom reflected from the walls is insignificant, and the effective value of a is equal to 1.

It has been assumed until quite recently that since there is a force field near a solid surface which attracts atoms, the probability of reflection from the surface should be small, and accordingly, a

28

should always be close to 1. However, during the past few years, because of improvements in experimental techniques, it has been possible to measure the accommodation coefficient for individual monocrystal faces of different materials, and also to begin studying the dependence of a on impurity concentration and on certain defects (for example, dislocations). It has been established already that the accommodation coefficient for metals evaporated in the form of atoms is actually close to unity; and for materials evaporated in the form of molecules, a is a structurally sensitive value and may be considerably less than unity. Thus, for example, according to [12], when NaCl is evaporated from the (100) face of a monocrystal, a increases from 0.5 to 1.0 with an increase in the number of dislocations from 106 to 107 cm-2. Relatively small impurity concentrations of CaCl2 (3 x 10-4) reduces the rate of evaporation of NaCl by approximately an order of magnitude [12], which corresponds to a = 0.1. Even smaller values of a (» 10-4) have been measured for the (111) face of a monocrystal of arsenic [13], where evaporation occurs in the form of As4 molecules.

Although the specific mechanisms for evaporation of different materials have not been studied in detail, in general the pattern of evaporation is as follows. At thermodynamic equilibrium with the material vapor, a crystal surface contains various defects: adsorbed atoms, vacancies, groups of vacancies, etc. (Fig. 2.10). From the condition of the minimum free energy for the system, the concentration of all the defects may be determined, in principle, if the energy and entropy of formation for each type of defect is known.*

However, during vacuum evaporation, the state of the surface may vary appreciably from this equilibrium concentration. The number of atoms (molecules) located at those positions where they may be easily evaporated decreases considerably. If the energy of formation in a completed surface is great, and if it is the defects which facilitate evaporation, then the rate of evaporation is determined by the concentration of steps on the surface (Fig. 2.11) and by the probability of emergence of an atom (molecule) from the kinks in the steps. If the slowest link in the chain of processes leading to evaporation is the formation of steps, it is clear that an increase of step concentration, and of the concentration of dislocations and other defects which facilitate generation of the steps, should contribute to an increase of the rate of evaporation. If the bottleneck for evaporation is the separating of atoms from steps, the evaporation process may be slowed down considerably when an impurity falls on the kink of a step, for then the energy of emergence from the kink is greater than normal.

Thus, the accommodation coefficient may be a rather ambiguous value, dependent on the surface structure and also on the type and concentration of surface defects. This is related to the fact that the atoms

Fig. 2.10

___________

*This is not true of dislocations, whose concentration is mainly determined by the prehistory of the specimen.

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(molecules) arriving at the surface from the vapor, during migration along the surface, may leave before they manage to become fixed into the crystal lattice. During migration, the molecules may also combine and be evaporated in the form of complexes. Complex formation is more probable in a deep opening or in an effusion chamber than during vacuum evaporation from a smooth surface. Thus, during evaporation of NaCl, the concentration of the dimer Na2Cl2 increases as the depth behind the aperture increases [14].

During evaporation into a gaseous medium -- for example, cathode evaporation in a Cs-filled thermionic converter -- the rate of evaporation of the cathode material decreases compared to the rate of vacuum evaporation, because the evaporated atoms may collide with atoms or ions of the gas and may return to the electrode. At high gas pressures, the flow of atoms from the cathode to the anode can be estimated from the diffusion equation

(5.4)

It is obvious from formula (5.4) that, in this case, the rate of evaporation decreases about d/la times, compared to the thermodynamic equilibrium rate (where la is the mean free path of the atoms of the cathode material in the Cs plasma, d is the interelectrode distance, and Na(T) is the equilibrium concentration of atoms near the cathode surface.

It should be noted in passing that the rate of evaporation in a real device may increase drastically if there are impurities or residual gases capable of forming volatile compounds with the material.

6. Surface Energy

Surface energy is equivalent to the work that must be expended in order to break chemical bonds and to form a free crystal (liquid) surface. This surface energy of a crystal is dependent on the crystallographic orientation of the faces. As is well known, crystals are sheared easily at those faces (cleavage planes) where the surface energy is minimum, for example, along the (100) face for ionic compounds which crystallize in a NaCl-type lattice.

Fig. 2.11

The state of a system with the least free energy (including the surface energy) is thermodynamically stable. Therefore, during self-diffusion, migration, and evaporation, those faces with the least surface energy will grow at the expense of other faces which have greater surface energy, even if the total surface area of the body increases somewhat. Because of this process, an initially polished surface of a monocrystal (or polycrystal) becomes covered with recesses or facets, so that the greater part of the free surface consists of grains

30

with least surface energy. Since the work function and adsorption energy at different orientations are different, such changes in the surface structure may have an appreciable effect on TIC operation. Therefore, for a TIC cathode, it is desirable to use thermodynamically stable, monocrystal surfaces or oriented polycrystalline surfaces.

This transformation to minimum surface energy also causes surface atoms to be shifted from the equilibrium positions they would occupy were they in the crystal volume. These shifts have been calculated for ionic crystals, and have been recently measured using low energy electron diffraction.* Although the shifts of the surface atoms are small compared to the equilibrium distance between the atoms, they may affect to some extent the anisotropy of the work function for different crystal faces.

The ion concentration on the surface in metal alloys and solid solutions may differ considerably from the volume concentration. For example, it is obvious that, all things being equal, large ions are easier to find on the surface than inside a crystal. But variation in surface concentrations leads to the formation of a charge double layer near the surface and to a corresponding variation in the work function. Therefore, the work function of an alloy frequently varies as a nonlinear function of concentrations. A similar phenomenon is observed with solid solutions of the oxides of alkaline earth metals (as in oxide cathodes), where the solid solutions BaO - SrO or SrO - CaO are considerably more efficient than pure oxides. The dipole moment of the double layer near the surface of solid solutions of ionic crystals was calculated in [15], but the corresponding calculations have not yet been carried out for metal alloys.

7. Adsorption and Its Effect on the Work Function

Not only the atoms (molecules) of the substrate but any other atoms, molecules, and even radicals which are unstable in a free state may be bound to a crystal surface. This phenomenon is called adsorption. Evaporation of foreign atoms from the surface is called desorption. Desorption requires energy expenditure to overcome the potential barrier which holds a particle to the surface.

The rate of desorption, i.e., the number of particles evaporated from a unit surface per unit time, is usually well described by the Frenkel formula [16]:

(7.1)

where N is the surface concentration of the adsorbed particles, H is the heat of evaporation, and f some coefficient having dimensions sec-1. To an order of magnitude, f has the value of the average vibration

_________

*Electrons with an energy of about 100 eV interact only with the first 1-3 layers of atoms. By studying the diffraction pattern created by the reflected electrons upon irradiation of the surface by such a low energy electron beam, the structure of the surface layer of atoms can be determined. This method is also suitable for determining the structure of the layer of adsorbed foreign atoms, if the latter forms a regular array.

31

frequency of the adsorbed particle on the surface.

As adsorbate concentrations increase, the interaction between adsorbed particles becomes significant and H usually decreases. In the case of a real surface, the heat of evaporation may increase if the particle is adsorbed on some surface defect, for example, on a vacancy, a jog, or at the exit to a dislocation surface, etc.

The high value of the heat of evaporation often observed during adsorption (for example, of cesium or oxygen on tungsten) indicates that a strong chemical bond may occur between the adsorbed particle and the substrate. It is to be expected that such a strong bond would always be accompanied by significant redistribution of the valence electron density, and that this redistribution of the electron density on the surface of the solid would in turn be accompanied by a change of the work function. Accurate quantum-mechanical calculations of the electron density distribution between the adsorbed particle and the substrate are rather complicated and do not yet yield reliable values for the binding energy and for the dipole moment of adsorption. However, in a number of cases (in particular, for the adsorption of Cs on refractory metals), some rather crude models are useful.

When a Cs atom approaches a metal having a vacuum work function greater than the ionization energy Eion (3.89 eV) the atom becomes ionized when it is near enough that electron transitions between the atom and metal become possible; the valence electron of the atom transfers to the metal. The resulting Cs+ ion is drawn toward the surface of the metal until the force of attraction to the negative induced charge is just equalized by the repulsive forces due to overlapping of electron shells, which increase very rapidly at small distances (Fig. 2.12).* The equilibrium distance from the center of the ion to the surface of the substrate should be close to the ion radius (for Cs+, R+ = 1.65Å). In this simple model, the heat of desorption is @

(7.2)

The change in the work function D f is equal to the dipole moment of the double layer formed by the positive ions and the induced negative charges on the surface:

(7.3)

where N is the surface concentration of Cs+.

Table 2.1 Heat of Adsorption H of Barium on Tungsten for Various Crystallographic Orientations and Vacuum Work Functions f O

Face

H,eV

f O,eV

Face

H,eV

f O,eV

(110)

2.33

5.40

(100)

5.28

4.55

(112)

4.72

4.80

(111)

4.92

4.42

__________________

*An adsorbed BaO molecule is depicted schematically in the same figure.

@ No distinction is made here between adsorption energy and heat of adsorption (desorption).

32

For Cs on tungsten (f o = 4.5 eV), H » 2.8 eV is obtained from (7.2), which agrees well with the experimental value: H » 3 eV [8]. Equation (7.2) easily explains the well known experimental fact that Cs is bound more strongly to those monocrystal faces that have the greater vacuum work function (for example, the (100) face of a monocrystal of tungsten with (f o = 5.20 eV).

The adsorbed layer is usually characterized, not by an absolute surface concentration, but by the relative coverage

q = N/Nmax

where Nmax is the greatest number of particles which can be arrayed on 1 cm of surface, with dense packing. The value f = 1 corresponds to a monolayer.

As the extent of coverage increases, adsorbed Cs ions begin to be affected more by mutual interaction leading to a decrease in adsorption energy. Thus, for Cs on W, the heat of adsorption for a single added Cs atom decreases from about 3 eV at the beginning of a monolayer to about 2 eV at the completion of the monolayer. As the density of the adsorbed ions increases, the positive potential of the adsorbed layer increases, and it becomes energetically more advantageous for the electrons to partially transfer to the adsorbed ions. This leads to a decrease of the dipole moment per adatom, and also to a decrease of the ionic and an increase in the covalent components for binding the surface layer to the substrate. Experimentally, it is usually found that the work function is a minimum with coverage close to or somewhat less than a monolayer.

If the coverage becomes greater than unity (or even before), the second layer begins to develop. In this case, bonding to the substrate becomes weak, and the heat of adsorption approaches the energy of evaporation for a surface of the adsorbate. The work function also rapidly approaches the work function of the adsorbate material.

It should be emphasized that the above model for ion binding is rather crude. It does not take into account covalent bonding and the polarization of electron shells. Even the concept of the surface charge density is unsatisfactory if we are talking about distances of the order of atomic distances. From this ion model, it is difficult to understand, for example, why Ba and Th are bound more firmly to the tungsten surface than is Cs. Unlike Cs on W, barium on tungsten does not show an increase of heat of adsorption as the substrate vacuum work function increases. This can be seen from Table 2.1 [17].

With the substrate in equilibrium with the adsorbate vapor (for example, Cs or Ba), a fractional coverage is established at which the rate of desorption is equal to the rate of incidence of adsorbate atoms from the gaseous phase (1/4 Nan a). In this case, according to (7.1), the coverage is determined by the expression

(7.4)

The work function is mainly a function of coverage: f = f (0).

It should also be noted that, in a number of cases, the adsorbed surface film has an ordered structure, dependent on the crystal structure of the substrate surface. These ordered systems are being investigated

33

by low energy electron diffraction.* At the high temperatures of TIC cathodes, however, any ordering should break down very rapidly.

It follows from (7.4) that the pressure should increase exponentially with temperature to maintain constant coverage. If pressure is kept constant as electrode temperature increases, then a monolayer coverage is at first retained (even to elevated temperature), but then the coverage decreases with increasing temperature until the surface is completely free of the adsorbate. Since the heat of adsorption increases as the coating decreases, the transition from q = 1 to q = 0 usually spans a rather wide range of temperatures. At P = const and with variation of temperature, the emission current varies along the typical S-shaped curves shown in Fig. 2.13. The slope of segment I corresponds approximately to the work function of the adsorbate. The slope of section III corresponds to the work function of the pure substrate metal. In the intermediate zone II, the work function increases as temperature increases. This leads initially to a slowing down of the increase of emission current, but when the effect of changes in 0 begin to dominate the increase of T (in the exponent of (1.7)), the emission current decreases with temperature (the descending segment of the S-curve). The emission current again begins to increase only at a coverage of about 0.1, when the increase of the work function is slowed down as it approaches the work function of the substrate. Segment II is more elongated and smoother (i.e., with a smaller amplitude of current variation) for a polycrystalline surface, as compared to a monocrystal surface, because different patches have different heats of adsorption and different work functions.

8. Surface Ionization [20]

Atoms (or molecules) may be desorbed from a surface not only as neutral particles but also as ions. Since the desorption process involves a comparatively slow migration of heavy particles, the electrons of the desorbing particle are in equilibrium with the electrons of the substrate for a rather long time. Therefore, the ratio of the probabilities of desorption in the form of atoms and in the form of ions is equal to the Boltzmann factor

Fig. 2.12

(8.1)

where gi is the statistical weight of the ion and ga is the statistical weight of the unexcited atom. It is obvious from

______________

*As the ordered structure of the adsorbed layer varies, the work function may also vary, even with a constant degree of coverage. For example, Cs adatoms on a (111) face of a Ge crystal readily combine into Cs2 molecules, which form different regular structures on the surface [18]. In this case, the work function increases considerably (up to 1 eV) above that of an amorphous Cs layer. With the formation of Cs2 molecules on the surface, it is apparently more convenient for the Cs adatoms to take part of their charge from the substrate. However, during adsorption of Cs on the (110) face, the order-disorder transition hardly changes the work function [19].

34

(8.1) that if the work function is greater than the ionization energy, then primarily ions are desorbed; in the opposite case, primarily atoms are desorbed.

In like fashion, in the case of desorption of a negative ion, we have

(8.2)

where Eea is the energy liberated during formation of the negative ion (electron affinity). Also, for desorption of an atom in an excited state with energy Ek, we have

(8.3)

where gk is the statistical weight of the state with excitation energy Ek.

To determine the total desorption rate, it is necessary to add the desorption rates for all possible states.

Fig. 2.13

9. Adsorption of Cesium on Refractory Metals

So far, cesium vapor has been used in the interelectrode space of all practical thermionic converters. In most cases, the required electrode work function is provided by the adsorption of cesium. It is understandable that the behavior of the layer adsorbed on the electrodes and its effect on the work function of the substrate determines to a great extent the operating characteristics of the TIC. Therefore, let us consider in detail the experimental data for adsorption of Cs on those refractory metals most promising for electrodes: W, Re, Mo, Nb, etc.

As already noted, the most suitable electrodes for TIC cathodes are monocrystalline surfaces. However, the electrodes of real converters are usually cylindrical; therefore, oriented vapor deposited coatings are now used extensively for cathodes. Tungsten, precipitated out from tungsten chloride or fluoride vapor with a preferred (110) orientation is used most frequently. Such cathodes are rather stable and have a high vacuum work function (4.9-5.1 eV). Because of their grainy, faceted structure, they sometimes exceed smooth monocrystalline specimens in output performance [24].

The main feature of the adsorption system for the TIC is the dependence of the work function on the electrode temperature and the cesium vapor pressure. Therefore, the family of S-curves for a number of cesium pressures (or atom arrival rates) yields the essential information about the system. These families are presented in Fig. 2.14 and 2.15 for polycrystalline W and Mo.

As already noted, in metals with a higher vacuum work function f o, the energy of desorption is also greater; therefore, at pCs = const, the same degree of coverage occurs at a higher substrate temperature. This significantly increases the emission currents and shifts the maximum

35

Fig. 2.14

emission toward high temperatures. The differences in the change of work function for different materials with the same degree of coverage are not very great (Fig. 2.16) and have a much smaller effect on the magnitude of thermionic emission.

Because of the comparatively low heats of desorption for cesium on refractory metals (H » 3.5 - 2.5 eV as q ® 0), the "working" pressures which provide the required cathode emission at the temperatures of practical interest are rather high, in the range of 10-1 to 10 torr and above.

The descending segment of the S-curves is used for cathode operation. The region of the ascending segment of the S-curves, where the work function is close to minimum, is used for anode operation (TA » 800 - l200° K).

The curves for the dependence of the work function and heat of desorption on the degree of coverage yield more complete information about the adsorption system. The S—curves, which were discussed with formula (7.4), can be easily constructed from these data. However, direct measurement of the degree of coverage q (or of surface density N) can be made simply only at low substrate temperatures and with non-equilibrium films, i.e., with those films for which the rate of desorption is negligible, and therefore, which may exist for a long time without the incidence of adsorbate atoms.

Under these non-equilibrium conditions, the calibrated beam method

36

Fig. 2.15

and the method that measures Auger transitions in the adsorbed atoms have been used successfully to measure coverage. The first method yields good results when the accommodation coefficient equals 1 and when there is negligible diffusion of the adsorbed atoms to the unexposed sections of the specimen (to the other side of the specimen, to the holder, etc.). The degree of coverage is then strictly proportional to the spraying time. The beam is usually calibrated by ion current from a hot filament placed in the beam. The hot filament ionizes the beam by surface ionization.

In the second method, as during investigations with slow electron diffraction, the surface is irradiated by electrons with an energy of several keV, and the secondary electron spectrum is analyzed in the energy range of tens and hundreds of volts. The primary electrons ionize the adsorbate atoms by removal of electrons from inner shells. The vacancies in the inner shells are then filled by outer electrons, and the excess energy from the latter transitions is used to eject secondary electrons. Thus, Auger peaks occur in the secondary electron energy spectrum corresponding to transition thresholds. The locations of these peaks identify the type of atoms involved. By measuring the relative magnitude of peaks, the surface concentration of the adsorbate atoms and also of various impurities can be determined very accurately.

Determination of the degree of coverage for films in equilibrium with the vapor is possible only at low cesium pressures (l0-5 to 10-6 torr) and is a difficult problem.* But the state of the adsorbed film may appreciably affect its properties (and therefore the degree of coverage). Therefore, the values of H(q ) and f (q ) obtained at these low temperatures and pressures are to be extrapolated to the range of temperatures and pressures corresponding to normal TIC operating conditions, This extrapolation should be made very carefully. @

______________

*The most careful measurements of the degree of coverage under these conditions were carried out by Langmuir and Taylor [8].

@In some cases, for example during adsorption of Ba on the (100) face of tungsten [25], variation of the surface properties has been observed upon heating.

37

Fig. 2.16

The data presented in Fig. 2.17 for the heat of desorption of cesium from the various surface orientations of monocrystalline tungsten were obtained for a layer in equilibrium with a beam of cesium atoms and at a rather high substrate temperature. The dependence of work function of these same orientations on the surface concentration (taking data from field emission measurements) is presented in Fig. 2.18. The S-curves determine the emission current and work function as a function of two parameters: the Cs vapor pressure and substrate surface temperature. In practice, it is very useful to be able to extrapolate the data on the work function obtained at low Cs pressures (that is, when there is no electron and ion scattering in the interelectrode gap) into the range of higher (more practical) pressures and higher temperatures. For such extrapolations, it is desirable, at least approximately, to reduce the two parameters to one.

For the equilibrium between an adsorbed layer and Cs vapor as described by formula (7.4), we have

(9.1)

where P0 is some constant (with the dimensions of pressure) determined experimentally for the surface. With ordinary degrees of coverage, 0.2 < 0 < 1, the heat of adsorption satisfies H(q ) » kT/lnq , and it is possible to assume with good accuracy that the degree of coverage q

38

Fig. 2.17

Fig. 2.18

and the surface work function f ( q ) are dependent on a single parameter kT ln(PCs/Po).

The dependence of f on kT ln(PCs/Po) for polycrystalline tungsten with preferred surface orientation of (110) is shown in Fig. 2.19. The experimental points, obtained from measuring the electron and ion emission at different pressures and temperatures, can be plotted on a common curve with a spread of 0.02—0.03 eV [26]. If we assume that

(9.2)

then from (9.1), we find

(9.3)

In practice, the reservoir temperature TR usually varies within a comparatively narrow range (500 ~ 700° K). Because of this TR in the brackets of (9.3) can be replaced by some average value, and one may assume that the degree of coverage and the work function of a given surface are universal functions of a single parameter T/TR The relations f (T/TR) are called T/TR plots or Rasor curves [27]. Because of the simplicity of plotting, they have found extensive application in the processing of experimental data, although they should yield a somewhat greater spread of points for different values of PCs than the dependence of f on kT ln(PCs/Po) considered above. As an example, the experimental data for the work function of the main faces of a tungsten

39

Fig. 2.19

monocrystal in Cs vapor are presented in Fig. 2.20a as a T/TR plot.

It follows from the theory of ion adsorption for Cs on a metal surface that the heat of adsorption is calculated by formulas (7.2) and (7.3):

(9.4)

and the work function is

(9.5)

where Hint(q ) and f int(q ) are some functions weakly dependent on the surface properties and determined by the degree of coverage q .

As can be seen from formulas (9.4) and (9.5) (to the approximation given) the surface properties are determined by a single easily measured parameter--the vacuum work function f o. Different metal surfaces with identical f o should behave identically. The family of Rasor curves for different work functions, for which Hint(q ) and f int( q ) were calculated from experimental data [8], is presented in Fig. 2.20b. These curves agree satisfactorily (within 0.1-0.3 eV) with experimental data for polycrystalline surfaces of refractory metals in the range of TIC operating temperatures and pressures [27]. However, a greater spread, which indicates the necessity of a variation in the selection of Hint(q ) and f int( q ) , is observed for monocrystalline surfaces.

Adsorption of atoms of other alkali metals is similar to cesium adsorption, although the ion adsorption approximation is somewhat worse for them. The magnitude of the decrease in work function for a given substrate, in the series Rb-K-Na-Li, gradually decreases, and the heat of desorption of the atoms decreases in the same sequence, but much more slowly. These metals have not found application in TICs because of their higher ionization potential and the relatively low efficiency of the adsorbed layers compared to that of cesium.

10. Electropositive Additives in TICs

The disadvantage of cesium as an adsorbate is its comparatively low heat of desorption. Therefore, high Cs vapor pressures are required to obtain appropriate work functions. This leads to excessive electron scattering in the interelectrode space and, therefore, to reduced currents and power in the TIC output. The idea naturally occurs of introducing an additional component into the TIC, along with the cesium, which has

40

Fig. 2.20

a high heat of adsorption and which provides the required cathode work function at lower pressures. In this way the electron scattering problem can be avoided. Some cesium could be there to give ions for space charge neutralization. Metals of the alkaline earth group--Ba, Sr, and Ca--are suitable as the additional vapor. The most promising among them is Ba, whose effect on the surface properties has been the most thoroughly investigated.

Barium has two valence electrons capable of binding with the substrate. The first barium ionization potential is equal to 5.15 eV, the second is equal to 15 eV. Therefore, one may expect that the ion adsorption model for Ba is not appropriate. Actually, unlike Cs, the vacuum work function of the substrate plays a secondary role in the adsorption of barium, and the role of the crystalline structure of the substrate becomes dominant. It is obvious, from Table 2.1 for the heats of desorption of Ba from different tungsten faces, that the (110) face (with the maximum work function) has the worst adsorption capacity (low desorption). The heat of desorption of Ba on the (100) face which has a small work function is more than double that of the (110) face.

Calculated per atom, the adsorbed barium changes the surface work function slightly less than cesium changes it (Fig. 2.21); the maximum decrease of the work function for barium on tungsten is approximately 0.5 eV less than for cesium.

An interesting feature of the Ba-W system is the fact that the curves f ( q ) do not always have a minimum. A monotonic variation of

41

Fig. 2.21

of the function f ( q ) (curve 5 in Fig. 2.21a) was observed at rather high substrate temperatures (» 1000° K) on polycrystalline substrates [29] and also on the (100) face of a tungsten monocrystal [30].*

Unfortunately, there is poor agreement among the results from various authors [17, 25, 29-32] for the function H(q ) for the Ba-W system. Data on the heat of desorption presented for a tungsten monocrystal in Fig. 2.21b were taken from the same investigation [25] as were the corresponding curves of f ( q ) in Fig. 2.21a.

A beam of Ba atoms was used to produce the coverage in most of the barium measurements. A condensed barium phase can be maintained in equilibrium with the vapor only at high temperatures (» 1000° K) because of the relatively low vapor pressure of barium [33]. For an equilibrium measurement, the whole experiment must be maintained at this high temperature. Such measurements have been carried out only recently. Data obtained in [34, 35] for tungsten are presented in Fig. 2.22,

__________

* It is interesting to note that the presence of even small amounts of oxygen during barium adsorption (residual pressure of PO2 ³ 10-9 torr) leads to the occurrence of a minimum on the curve f ( q ) and to an additional decrease of the work function.

42

and the S-curves obtained for molybdenum in barium vapor are presented in Fig. 2.23.

It is obvious from Fig. 2.23 that the smaller change in surface work function compared to cesium (with the same degree of coverage) is more than compensated for by the high barium heat of desorption. Even at PBa » 0.01 - 0.1 torr, the maximum emission reaches values of the order of tens of amp/cm2, and the maximum of the S-curves occurs in the most favorable range (from the TIC viewpoint) of cathode temperatures (» 2000° K).

However, the anode work function in barium vapor is too high even with monolayer coatings (see Fig. 2.21). This circumstance is the main barrier to the use of Ba vapor in thermionic converters.

In conclusion, consider the problem of the simultaneous adsorption of barium and cesium. The presence of Cs in the gap of a TIC should hardly affect the electrode work function, because (with approximately identical cesium and barium pressures) the surface should be coated mostly by single atoms of barium, owing to the large difference in heats of desorption of cesium and barium. This conclusion has been confirmed by experimental results [34,36]. Even at a barium pressure PBa = 4 x l0-4 torr, the work function remains practically constant over a wide range of PCs and begins to decrease significantly only for PCs ³ 1 torr.

11. Electronegative Additives in TICs

One method for affecting the work function of electrodes in

Fig. 2.22

Fig. 2.23

43

cesium vapor is to introduce electronegative elements or compounds into the converter: oxygen, halogens, or their compounds with cesium. The joint adsorption of electronegative atoms and cesium increases the cesium heat of desorption and leads to a much greater decrease in the work function, not only of the cathode, but more important, of the anode. The cesium pressure required to obtain the optimum cathode work function decreases accordingly, because the general output characteristics of the TIC are significantly improved [37].

It is true that the presence of electronegative additives in the converter (especially of oxygen and fluorine) leads to an increase in electrode corrosion. This occurs when metal-additive compounds form on the electrode surface, compounds which have a heat of vaporization lower than that of the pure metal. In particular, the rate of oxide evaporation, even for such stable metals as Re and W (Fig. 2.24), is a marked increase over the pure metal. The cathode material is removed even more rapidly in the case of cyclic chemical reactions.* As a result, the operating life of TICs can be reduced considerably. However, in many cases the use of additives may still be feasible. It should also be kept in mind, however, that the presence of residual gases inside the TIC has an appreciable effect on its operation.

Fig. 2.24

Consider first the adsorption characteristics of electronegative gases alone on refractory metals. The gas most important and most studied of this type is oxygen.

Oxygen adsorption. Oxygen transforms to a chemisorbed state, beginning at very low temperatures. In this case, the first adsorbed layer is bound to the surface of the metal very strongly (Table 2.2 [40]), while the succeeding layers are much more weakly bound. Oxygen adsorption (as well as the adsorption of other electronegative atoms) usually leads to an increase in the work function of the metal surface.

The adsorbed oxygen layer forms various ordered structures on the metal surface (even at comparatively high substrate temperatures). These are distinguished by different desorption energies and different substrate work functions. As the adsorbed layer is heated, not only is there partial evaporation of the oxygen but variation of the surface structure as well. Under some conditions, the adsorbed oxygen layer may

___________

*A typical example of this reaction is the "water cycle" with Mo or W [39]. When water vapor impinges on the surface of a Mo or W cathode, the H20 molecule dissociates and volatile oxides of these metals form, which are then desorbed together with the hydrogen. The oxides condense on some colder surface where they are reduced by hydrogen. The atoms of the metal remain on this surface. The resulting water is evaporated and may again impinge on the cathode.

44

even reduce the work function of the metal [41,42]. Oxides begin to form on the surface (even on oxygen—resistant metals) at temperatures around 700 - 1000° K, and further heating results in evaporation not only of oxygen but of the oxidation products as well. Also, etching of loosely packed planes into densely packed facets can occur for some metals - for example, the (100) and (111) planes of W are etched to (112) and (110) facets [42,43].

Fig. 2.25

A free oxygen layer is completely removed from a metal surface only at very high temperatures - for example, at about 1400° K for Mo and about 2000° K for W. At higher temperatures, the adsorbed layer may exist only with a continuous supply of oxygen to the surface from outside or by diffusion from inside the metal.* These equilibrium oxygen layers on refractory metals increase the substrate work function. Some dependence of the work function of W on temperature at different oxygen pressures is presented in Fig. 2.25.

Thick oxide layers form on the surface of metals not resistant to oxygen (for example, Ta and Ni). From these layers, oxygen diffuses into

Table 2.2 Energies for Chemisorption of Oxygen on Different Faces of Tungsten

Face

(112)

(111)

(100)

(110)

H, eV

6.0

5.8

5.8

5.4

the metal as temperature increases. These oxygen-saturated metals maintain an adsorbed film for a long time in the absence of an external oxygen source. @

___________

*Complete removal of oxygen from the metal requires heating to about 1700° K for Mo and about 2500° K for w [44].

@Removal of oxygen from the volume requires careful heating at T » 2600° K for Ta [41]. Oxygen is removed from nickel only upon heating in a hydrogen atmosphere or during ion bombardment at T » 1000° K [46].

45

Fig. 2.26

Among the other electronegative gases, fluorine is most like oxygen in its adsorption properties. The remaining halogens interact more weakly with the metal substrate, have a lower heat of desorption, and alter the work function to a lesser extent [47].

The properties of complex adsorption layers. The role of electronegative atoms in complex coatings is that they increase the effective dipole moment of the electric double layer created by the Cs atoms on the metal surface and increase the binding energy of the cesium to the substrate. It is often assumed that these increases are the result of an increase of the substrate work function due to oxygen adsorption, but this point of view is too simple and does not explain the many features of this complex adsorption system. Most likely, the electronegative atoms and cesium atoms on the substrate surface enter into a complex interaction simultaneously with the atoms of the substrate and among themselves [48].

The change in the work functions of pure and oxidized tungsten is presented as a function of the degree of cesium coverage in Fig. 2.26. It is obvious that even with very small amounts of adsorbed oxygen, which essentially do not affect the substrate work function (curve 2), the contribution of each Cs atom to the reduction of the work function increases significantly. The cesium coverage at optimum (lowest work function) decreases by a third. With large amounts of adsorbed oxygen, which greatly increases the work function over that of pure tungsten, there is only a small further decrease in the optimum coverage, but a marked decrease in the minimum work function itself (curve 3). An increase in the heat of desorption with the presence of electronegative atoms is manifested most clearly in the shift of maximum emission in the S-curve to a higher temperature, an increase by as much as 200 - 300° .

We note that complex compounds consisting of cesium oxide, metal oxides of the substrate, and free Cs atoms may form on the substrate surface at low temperatures. These coatings (typical of photocathodes, for example) have very low work functions (» 1 eV). However, they are rapidly transformed at elevated temperatures; and. their work function increases so that, in the presence of different electronegative additives, it does not decrease below 1.3 - 1.4 eV at the lowest anode operating temperatures (» 700 - 800° K). (See, for example, [49].)

46

Oxygen affects an adsorbed barium layer in the same way. Unlike unstable compounds of CsxOy oxide, the BaO molecule is very stable and complex coatings of barium, barium oxide, and possibly, of oxygen should form on the surface.

With complex adsorption systems, change in the emission with substrate temperature (at constant cesium pressure) is dependent not only on the amount of electronegative atoms supplied to the substrate surface but on the method of delivering them.

The S-curves are determined by the flow rate of electronegative atoms to the surface, if this flow is constant. However, the most stable and reproducible results are observed if the electronegative gas compounds with cesium are used rather than the gases themselves. These compounds dissociate upon reaching the hot electrode surface so that the final emission result is the same as that for the incidence of an equivalent rate of the gases themselves.

Data for adsorption of cesium oxide on the most promising cathode materials, Re and W [50], are presented in Fig. 2.27. It is obvious from the figure that an increase of the cesium oxide flow to the substrate (determined by the temperature TCs2O of the oxide solid phase) is accompanied by a decrease in f only to a specific limit (with constant substrate temperature T). A further increase in the cesium oxide flow leads to an increase in the work function. The maximum decrease in the work function is somewhat greater for Re and reaches 0.3 - 0.5 eV for the conditions investigated, which corresponds to an increase of emission by approximately an order of magnitude.

An even greater increase of emission is observed with the introduction of fluorine [51]. There is also evidence that the emission from metals in cesium vapor increases with the addition of such gases as CO and H2.

Fig. 2.27

47

Metals which easily absorb oxygen (Ta, Ni and Cu), once subjected to its effects, yield a significant (and more stable) increase of emission in cesium vapor without an external oxygen source. In this case, the presence of low oxygen pressures has no effect on the emission, because the main input of oxygen atoms comes from inside the substrate. Changes in the S-curves, which in this case may have complicated appearance [52], is observed only with comparatively large additive concentrations. This effect is weaker when the substrate is W, Re, or Mo.

When cesium is adsorbed on a surface with a free oxygen layer,* relatively stable coatings may be formed only with a preliminary heating of the oxygen layer, to remove excess oxygen. This surface yields stable and reproducible S-curves, if the surface temperature is not raised, and if the surface is not subjected to prolonged ion or electron bombardment. The emission for cesium adsorbed on these coatings may exceed by orders of magnitude the emission for cesium adsorption on the pure metal. @

The presence of electronegative atoms is especially significant because of their effect on the anode work function. In cesium vapor, even a comparatively small amount of electronegative gases (primarily of oxygen) which is inevitably present in a real converter, reduces the anode work function to values of 1.5 - 1.6 eV. The anode work function may decrease to 1.3 - 1.4 eV with special introduction of electronegative components. The role of electronegative additives and of residual gases in converters filled with Ba is even more important, since in the absence of these additives, the anode has the work function of pure barium:

Fig. 2.28

f Ba = 2.4 eV,

We also note that by-products of cathode evaporation and also various types of contaminants are precipitated onto the anode in real converters, the anode being the colder structural element. Together with the residual gases and cesium adsorbed on the anode, they form a complex, rather thick coating. Therefore, the properties of the substrate anode material may not determine the properties of its surface (at least not for the full length of the TIC operating life).

12. The Vacuum Mode of TIC Operation

Consider now a TIC operating in the vacuum mode where the space charge of the electrons is not neutralized. The theory of the vacuum-mode

_________________

*A free layer should always exist on the electrodes at the beginning of TIC operation, that is, during the first cathode temperature rise.

@For example, heating of the oxygen layer on the tungsten to 1600° K leads to an increase of emission in the Cs vapor by more than a factor of 2 [53].

48

TIC reduces to the solution of the Langmuir problem for the passage of current through a diode [54,55] and is outlined in detail in [56-68].

Consider also a TIC with plane-parallel electrodes. This assumption is appropriate even for coaxial TICs since the radii of the electrode curvatures are always very large compared to the interelectrode gap. Assume also that the anode temperature TA is rather low, so that the electron emission from the anode can be ignored.

When current passes through this type of TIC (if the potential difference between the anode and cathode is small), the space charge of the electrons creates a potential barrier in the interelectrode space, which retards electrons emitted by the cathode (Fig. 2.28). Only those electrons which are capable of overcoming the potential barrier* pass to the anode, and the current j through the converter will be related to the emission current jS° by an expression similar to (1.7): Huh?

(12.1)

Here Vm is the potential height of the barrier (referenced to the cathode).

When a potential difference is applied across the vacuum space, the potential barrier Vm will decrease gradually and the current will increase. When the applied potential increases so much that the resulting field at the cathode reaches zero [E(0) = 0], the barrier disappears, the current through the converter reaches the cathode saturation current

?

and the current does not vary with further increase of potential across the electrode gap.

Application of an increasing electron-retarding field also eventually leads to the disappearance of the potential extreme in the interelectrode space. When this occurs the current is directly related to the value of the retarding voltage ō Vdō :

(12.2)

To plot the characteristic in the intermediate region (which naturally is of primary interest, because it contains what corresponds to the usual operating point of the TIC) it is necessary to establish the relationship between the value of the barrier I’m? and the voltage across the gap Vd. This relationship will be a function of the TIC parameters TC, jS° , and the size of the gap, d. We begin by considering the potential distribution of the interelectrode space.

This potential distribution is calculated from the simultaneous solution of Poisson’s equation

(12.3)

________________

*For convenience, instead of the ordinary potential y , consider the potential for a single negative charge V = -y ("the potential for an electron")--see Fig. 2.28.

49

the equation of the continuity of current through the interelectrode space

(12.4)

and the equation of electron energy conservation

(12.5)

The electron distribution function in the interelectrode space will be, in this case,

for the range 0 £ x £ xm,

?

for the range xm £ x £ d

?

where fm(n ) is the Maxwellian distribution function using the cathode temperature.

When solving this problem it is convenient to introduce the dimensionless potential (Huh?) y , referenced to the point of the maximum potential:

?

and the dimensionless coordinate x , referenced to the same point:

?

The solution is then expressed in the form of a special function (Huh?) y (x ), which is presented in Fig. 2.29. For given values of TC, jso, and d, this function makes it possible to find the potential distribution between the electrodes for any value of conduction current j. To do this it is necessary, having been given the value of current, to calculate in sequence Vm (from formula (12.1)), (Huh?) y 0 = eVm/ kT, x 0(y 0) (from the graph in Fig. 2.29), and xm = -x 0/c. By knowing Vm and xm, and again by using the graph of y (x, the value of the potential V(x) for any point of the interelectrode gap 0 £ x £ d can be found.

By calculating the value of V(d) = Vd for a number of values of

50

converter current in this manner, it is possible to plot the desired function j = f(Vd) over the range where a potential maximum exists, and therefore, to plot the full current-voltage characteristic of the TIC for given parameters TC, jso, d and f C.

Fig. 2.29

It can be shown that the function f(Vd), expressed in relative values of j/ jso and eVd/ kTC, is clearly specified by the dimensionless parameter

R = 84.24 x 1010 jS° d2/TC3/2

The family of these curves, calculated for different values of R, is presented in Fig. 2.30. In this case the current—voltage characteristic for the given TIC parameters is the curve for the corresponding value of R, shifted toward the region of negative (operating) voltages by an amount equal to the contact potential different D V = (f C - f A)/e *.

The limiting case of R ® 0 corresponds to the absence of space charge, and therefore, for this case the characteristic is an exponential up to the value of Vd = 0, where the current becomes constant at the saturation value. For R > 0, the total emission current is removed upon application of a potential difference Vd (>0), which increases as R increases, and a deviation of the characteristic from the above exponential begins at ever lower retarding potentials Vd.

It is obvious from Fig. 2.30 that no appreciable decrease of current by space charge occurs for R £ 10. It is easy to estimate the maximum interelectrode gap permitted for efficient operation of TICs in the vacuum mode, using this critical value. By assuming TC » l500° K and jso » 10 amp/cm2 (these figures correspond to the TIC output of practical interest, of the order of several W/cm2), at R = 10 we find d » 2.6 x l0-4 cm, a distance of the order of the Debye length LD.

Values of the interelectrode gap for TIC operation in the vacuum mode are shown in Fig. 2.31, where the calculated values of the nominal output are presented as a function of [58]. The effect of the contact potential difference of the cathode and anode on the TIC output is also clearly evident from Fig. 2.31. Since the cathode work function cannot be too high (to allow sufficient emission current), an anode with an even lower work function is required, to allow a significant voltage output. But a lower limit is set to the anode work function (according to the temperature), so that the electron emission from the anode remains low compared to that from the cathode.

The occurrence of excessive anode emission leads to a decrease in the output power of the TIC both as a result of reverse electron current (from the anode to the cathode), and as a result of an increase of the space charge, which reduces the electron current from the cathode [59].

At present, Vacuum TICs are rarely used because of design difficulties and because of the absence of suitable materials for electrodes.

_________________

*It follows from Fig. 2.28 that Vo = Vd - D V.

51

Fig. 2.30

Fig. 2.31

52

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5. T.E. Fischer, Physical Review Letters, 21, 31 , 1968,. Physical review & Physical review letters , combined cumulative subject index, 1951-1973. Language, English , eng,, Call Number, Z695.1.P5 N5

6. a, K. Herring and M. Nichols, Rev. Mod. Phys., 21, 185 , 1949,. Thermionic emission in an accelerating field, Language, English , eng,, Call Number, , LCCN, , Dewey Decimal, , ISBN/ISSN,

b, L. van Someren, Thermionic Conversion Specialists Conference, Carmel, p. 18 , 1969,.Thermionic emission in an accelerating field. As the electric field increases and all the patches become exposed , Fig. 2.8c,, b approaches 1. This occurs when the applied field becomes approximately equal in intensity to the patch field, E = D f /ea , where D f is the work function difference of adjacent patches and a is their linear dimension,. Thus, the value of the external field at which transition to the normal Schottky effect occurs , b = 1, is determined by the specific surface properties of the emitter and may vary over a wide range-from tens to 104 V/cm Language, English , eng,, Call Number, TK2955 .T4412 1969, LCCN, 88197004, Dewey Decimal, 621.31/243, ISBN/ISSN, -

7. T.V. Krachino and T.L. Matskevich, Radio Eng. Electron. Phys., 14, 1660 , 1969,.Thermionic emission in an accelerating field. As the electric field increases and all the patches become exposed , Fig. 2.8c,, b approaches 1. This occurs when the applied field becomes approximately equal in intensity to the patch field, E = D f /ea , where D f is the work function difference of adjacent patches and a is their linear dimension,. Thus, the value of the external field at which transition to the normal Schottky effect occurs , b = 1, is determined by the specific surface properties of the emitter and may vary over a wide range-from tens to 104 V/cm, Language, , Call Number, , LCCN, , Dewey Decimal, , ISBN/ISSN,

8. J.B. Taylor and I. Langmuir, Physical Review, 44, 423 , 1933,.Thermionic emission in an accelerating field. Patchiness may be especially pronounced on polycrystalline cathodes with adsorbed layers, because the different adsorption energies of the different faces cause large increases in the D f of the patches, Language, English , eng,, Call Number, QC1.P4, LCCN, , Dewey Decimal, 530/.05, ISBN/ISSN, 0031-899X 0096-8250 0096-8269

9. J.L. Desplat, Ph. Defranould, Proc. 2nd Int. Conference on Thermionic Electrical Power Generation, Stresa, p. 1389 , 1968,.Thermionic emission in an accelerating field. Patchiness may be especially pronounced on polycrystalline cathodes with adsorbed layers, because the different adsorption energies of the different faces cause large increases in the D f of the patches, Language, English , eng,, Call Number, , LCCN, , Dewey Decimal, , ISBN/ISSN,

10. Termodinamicheskiye svoystva individual’nykh veshchestv. Spravochnik pod red. V.P. Glushko, izd-vo AN USSR , 1962,.Evaporation. This saturated vapor pressure, for a given temperature, is determined exclusively by the thermodynamic properties of the material in its solid and gaseous phases, Language, , Call Number, , LCCN, , Dewey Decimal, , ISBN/ISSN,

11. A.N. Nesmeyanov, Davleniye para khimicheskikh elementov, izd-vo AN USSR , 1961,.Evaporation. so-called Knudsen effusion chamber, which, by analogy with the well known black-body model, is a cavity whose walls , with the exception of a small aperture, are covered with the investigated material, Language, , Call Number, , LCCN, , Dewey Decimal, , ISBN/ISSN,

12. J.E. Lester and G.A. Somorjai, J. Chem. Phys., 49, 2940 , 1968,.Evaporation. so-called Knudsen effusion chamber, which, by analogy with the well known black-body model, is a cavity whose walls , with the exception of a small aperture, are covered with the investigated material, Language, English , eng,, Call Number, , LCCN, , Dewey Decimal, , ISBN/ISSN,

13. G.M. Rosenblatt and Pang-Kai Lee, J. Chem. Phys., 49, 2995 , 1968,.Evaporation. Even smaller values of a , » 10-4, have been measured for the , 111, face of a monocrystal of arsenic, where evaporation occurs in the form of As4 molecules, Language, English , eng,, Call Number, , LCCN, , Dewey Decimal, , ISBN/ISSN,

14. W. Winterbottom, J. Chem. Phys., 51, 5610 , 1969,.Evaporation. Complex formation is more probable in a deep opening or in an effusion chamber than during vacuum evaporation from a smooth surface. Thus, during evaporation of NaCl, the concentration of the dimer Na2Cl2 increases as the depth behind the aperture increases, Language, English , eng,, Call Number, , LCCN, , Dewey Decimal, , ISBN/ISSN,

15. Yu. A. Logatchov and B. Ia. Moyzhes, Surface Science, 17, 504 , 1969,.Surface energy. The dipole moment of the double layer near the surface of solid solutions of ionic crystals was calculated in, but the corresponding calculations have not yet been carried out for metal alloys, Language, English , eng,, Call Number, QD506 .S8, LCCN, , Dewey Decimal, , ISBN/ISSN, 0039-6028

16. Ya. I. Frenkel’, Statisticheskaya fizika, izd-vo AN USSR , 1948,.Adsorption and its effect on the work function. Frenkel formula, Language, , Call Number, , LCCN, , Dewey Decimal, , ISBN/ISSN,

17. U.V. Azizov and G.N. Shuppe, Sov. Phys. - Solid State, 7, 1591 , 1966,.Adsorption and its effect on the work function. Electropositive additives in TICs., Language, , Call Number, , LCCN, , Dewey Decimal, , ISBN/ISSN,

18. R.E. Weber and A.L. Johnson, Journal of Applied Physics, 40, 314 , 1969,.Adsorption and its effect on the work function, Language, English , eng,, Call Number, QC1.J83, LCCN, , Dewey Decimal, 530.5, ISBN/ISSN, 0021-8979

19. A.G. Fedorus and A.G. Naumovets, Surface Science, 21, 426 , 1970,.Adsorption and its effect on the work function, Language, English , eng,, Call Number, QD506 .S8, LCCN, , Dewey Decimal, , ISBN/ISSN, 0039-6028

20. E. Yu. Zandberg, N.I. Ionov, Poverkhnostnaya ionizatsiya, "Nauka" , 1969,.Surface ionization, Language, , Call Number, , LCCN, , Dewey Decimal, , ISBN/ISSN,

21. J.M. Houston and H.F. Webster, Adv. in Electronics and Electron Physics, L. Martin, ed. vol. 17, Academic Press, New York, p. 125 , 1962,. Language, English , eng,, Call Number, , LCCN, , Dewey Decimal, , ISBN/ISSN,

22. a, R.L. Aamodt, I.J. Brown, and V.D. Nichols, Journal of Applied Physics, 33, 2080 , 1962,. Language, English , eng,, Call Number, QC1.J83, LCCN, , Dewey Decimal, 530.5, ISBN/ISSN, 0021-8979

b, W.A. Ranken, et. al., Advanced Energy Conversion, 3, 235 , 1963,. Language, English , eng,, Call Number, TK2896 .A5, LCCN, , Dewey Decimal, , ISBN/ISSN, 0365-1789

23. L.W. Swanson and R.W. Strayer, J. Chem. Phys., 48, 2421 , 1968,. Language, English , eng,, Call Number, , LCCN, , Dewey Decimal, , ISBN/ISSN,

24. a, P. Batzies, P. Schroder-Bobo, and G. Wahi, 3rd Int. Conference on Thermionic Electrical Power Generation, Jülich, p. 845 , 1972,. Adsorption of cesium on refractory metals,Language, English , eng,, Call Number, TK2955 .I58 1972, LCCN, 75313167 //r893, Dewey Decimal, 621.312/139, ISBN/ISSN, -

b, J.C. Danko and G.W. Titus, Thermionic Conversion Specialist Conference, Miami Beach, p. 82 , 1970,. Adsorption of cesium on refractory metals, Language, English , eng,, Call Number, , LCCN, , Dewey Decimal, , ISBN/ISSN,

c, J. Dunlay and R. Meyers, ibid, p. 86 Adsorption of cesium on refractory metals,

d, R.J. McCandless and D. R. Wilkins, ibid, p. 227 Adsorption of cesium on refractory metals,

53

25. Yu. S. Vedula, et.al, [24a], p. 135.Adsorption of cesium on refractory metals, Electropositive additives in TICs,

26. G.N. Hatsopoulos and F. Rufeh, [6b], P. 1.Thermionic emission in an accelerating field,

27. N.S. Rasor and C. Warner, Journal of Applied Physics, 35, 2589 , 1964,.Adsorption of cesium on refractory metals, Language, English , eng,, Call Number, QC1.J83, LCCN, , Dewey Decimal, 530.5, ISBN/ISSN, 0021-8979

28. R.J. McCandless and D.R. Wilkins, [24b], p. 210.Adsorption of cesium on refractory metals,

29. G.E. Moor and H.W. Allison, J. Chem. Phys., 23, 1609 , 1955,.Electropositive additives in TICs, Language, English , eng,, Call Number, , LCCN, , Dewey Decimal, , ISBN/ISSN,

30. a, Ya. P. Zingerman, V.A. Ischuk, and V.A. Morozovskii, Sov. Phys. - Solid State, 2, 2030 , 1961,. Electropositive additives in TICs, Language, , Call Number, , LCCN, , Dewey Decimal, , ISBN/ISSN,

b, Yu. V. Zubenko and T.L. Sokol’skaya, Sov. Phys. - Solid State, 3, 1133 , 1961,.Electropositive additives in TICs, Language, , Call Number, , LCCN, , Dewey Decimal, , ISBN/ISSN,

31. B.V. Bondarenko, E.D. Konovalov, and E.A. Tishin, Sov. Phys. - Solid State, 14, 3078 , 1973,.Electropositive additives in TICs, Language, , Call Number, , LCCN, , Dewey Decimal, , ISBN/ISSN,

32. H. Utsugi and R. Gomer, J. Chem. Phys., 37, 1706 , 1962,.Electropositive additives in TICs, Language, English , eng,, Call Number, , LCCN, , Dewey Decimal, , ISBN/ISSN,

33. R.E. Honig and D.A. Kramer, RCA Review, 30, 285 , 1969,.Electropositive additives in TICs, Language, English , eng,, Call Number, , LCCN, , Dewey Decimal, , ISBN/ISSN,

34. J. Psarouthakis and W.J. Levedahl, Proc. 1st Int. Conference on Thermionic Electrical Power Generation, London , 1965,.Electropositive additives in TICs, Language, English , eng,, Call Number, TK2950 .I57 1965, LCCN, 68103750 //r862, Dewey Decimal, 621.312/139, ISBN/ISSN, -

35. I.G. Gverdtsiteli, et.al., [9], p. 1097.Electropositive additives in TICs, Thermionic emission in an accelerating field,

36. V.D. Bondarenko, A.I. Loshkarev, and B. Sh. Ul’masbaev, High Temp., 8, 201 , 1970,.Electropositive additives in TICs, Language, English , eng,, Call Number, , LCCN, , Dewey Decimal, , ISBN/ISSN,

37. D. Lieb, F. Rufeh, [24b], p. 471.Adsorption of cesium on refractory metals, Electronegative additives in TICs,

38. R.L. Wagner, [6b], p. 411.Thermionic emission in an accelerating field,

39. a, R.L. McKisson, Advanced Energy Conversion, 3, 137 , 1963,.Electronegative additives in TICs, Adsorption of cesium on refractory metals, Language, English , eng,, Call Number, TK2896 .A5, LCCN, , Dewey Decimal, , ISBN/ISSN, 0365-1789

b, G. Wahl, J. Demny, and P. Batzies, [24a], p. 896.Electronegative additives in TICs, Adsorption of cesium on refractory metals,

40. B. McCarroll, J. Chem. Phys., 46, 863 , 1967,.Electronegative additives in TICs, Language, English , eng,, Call Number, , LCCN, , Dewey Decimal, , ISBN/ISSN,

41. a, O.L. Fehrs and R.E. Stickney, Surface Science, 8, 267 , 1967,. Electronegative additives in TICs, Language, English , eng,, Call Number, QD506 .S8, LCCN, , Dewey Decimal, , ISBN/ISSN, 0039-6028

b, B.J. Hopkins, C.B. Williams, and P.C. Wilmer, Surface Science, 25, 633 , 1971,.Electronegative additives in TICs, Language, English , eng,, Call Number, QD506 .S8, LCCN, , Dewey Decimal, , ISBN/ISSN, 0039-6028

42. A.E. Bell, L. W. Swanson, and L.C. Crouser, Surface Science, 10, 254 , 1968,.Electronegative additives in TICs, Language, English , eng,, Call Number, QD506 .S8, LCCN, , Dewey Decimal, , ISBN/ISSN, 0039-6028

43. J.C. Tracy and J.M. Blakey, Surface Science, 13, 313 , 1969,.Electronegative additives in TICs, Language, English , eng,, Call Number, QD506 .S8, LCCN, , Dewey Decimal, , ISBN/ISSN, 0039-6028

44. S. Dushman and J.M. Lafferty, Scientific Foundations of Vacuum Technique, 2nd ed., John Wiley and Sons, New York , 1962,.Electronegative additives in TICs, Language, English , eng,, Call Number, QC166 .D85 1962, LCCN, 61017361 /L/r962, Dewey Decimal, 533.5, ISBN/ISSN, -

45. P. Batzies, [9], p. 1357.Electronegative additives in TICs, Thermionic emission in an accelerating field,

46. J.W. May and L.H. Germer, Surface Science, 11, 443 , 1968,.Electronegative additives in TICs, Language, English , eng,, Call Number, QD506 .S8, LCCN, , Dewey Decimal, , ISBN/ISSN, 0039-6028

47. C.W. Jowett and B.J. Hopkins, Surface Science, 22, 392 , 1970,.Electronegative additives in TICs, Language, English , eng,, Call Number, QD506 .S8, LCCN, , Dewey Decimal, , ISBN/ISSN, 0039-6028

48. J.M. Chen, Journal of Applied Physics, 41, 5008 , 1970,.Electronegative additives in TICs, Language, English , eng,, Call Number, QC1.J83, LCCN, , Dewey Decimal, 530.5, ISBN/ISSN, 0021-8979

49. T. Alleau and M. Bacal, [24b], p. 434.Electronegative additives in TICs, Adsorption of cesium on refractory metals,

50. R. Langpape and A. Minor, [9], p. 1367.Electronegative additives in TICs, Thermionic emission in an accelerating field,

51. R. Langpape and A. Minor, [34].Electronegative additives in TICs, Electropositive additives in TICs,

52. R.G. Wilson, Surface Science, 7, 157 , 1967,.Electronegative additives in TICs, Language, English , eng,, Call Number, QD506 .S8, LCCN, , Dewey Decimal, , ISBN/ISSN, 0039-6028

Industrial Engineering Chemistry

53. I. Langmuir, Industr. Eng. Chem., 22, 390 , 1930,.The vacuum mode of TIC operation, Language, English , eng,, Call Number, , LCCN, , Dewey Decimal, , ISBN/ISSN,

54

54. V.R. Bursian, ZhRFKhO, 51, 289 , 1921,.The vacuum mode of TIC operation, Language, English , eng,, Call Number, , LCCN, , Dewey Decimal, , ISBN/ISSN,

55. L.N. Dobretsov and M.V. Gomoyunova, Emission Electronics, Israel Program for Scientific Translations, Jerusalem , 1971,.The vacuum mode of TIC operation, Language, English , eng,, Call Number, QC721 .D5913, LCCN, 71181530 //r872, Dewey Decimal, 539.7/2112, ISBN/ISSN, -

56. A.I. Ansel’m, Termoelektronnyy termoelement, izd-vo AN USSR , 1951,.The vacuum mode of TIC operation, Language, , Call Number, , LCCN, , Dewey Decimal, , ISBN/ISSN,

Journal Electronics

57. H. Moss, J. Electronics, 2, 305 , 1957,.The vacuum mode of TIC operation, Language, English , eng,, Call Number, , LCCN, , Dewey Decimal, , ISBN/ISSN,

58. H.F. Webster, Journal of Applied Physics, 30, 488 , 1959,.The vacuum mode of TIC operation, Language, English , eng,, Call Number, QC1.J83, LCCN, , Dewey Decimal, 530.5, ISBN/ISSN, 0021-8979

Journal Electronics and Control

59. P.A. Lindsay and F.W. Parker, Brit. J. Electronics and Control, 7, 289 , 1959,.The vacuum mode of TIC operation, Language, English , eng,, Call Number, , LCCN, , Dewey Decimal, , ISBN/ISSN,

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